Wafer-Level Packaging [WLP]

“Wafer-level packaging (WLP) is the technology of packaging an integrated circuit while still part of the wafer, in contrast to the more conventional method of slicing the wafer into individual circuits (dice) and then packaging them.”

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Tags: Electrical Component, Electrical Engineering

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In a Harvard Business Review article called “Sleep Deficit: The Performance Killer,” Charles A. Czeisler, the Baldino Professor of Sleep Medicine at Harvard Medical School, has explained how sleep deprivation undermines high performance. He likens sleep deficit to drinking too much alcohol, explaining that pulling an all-nighter (i.e., going twenty-four hours without sleep) or having a week of sleeping just four or five hours a night actually “induces an impairment equivalent to a blood alcohol level of 0.1%. Think about this: we would never say, ‘This person is a great worker! He’s drunk all the time!’ yet we continue to celebrate people who sacrifice sleep for work.”