COGS: Cost of goods sold. The total amount of money spent to produce the inventory divided by the number of units in inventory. COGS includes assembly, freight, logistics, duties, marketing, etc.
Hardware: a physical entity of a larger system, such as a chip on a circuit board
Software: a module in modular systems
For component that is part of a component-based arch:
A component is a self-contained, usually concurrent, object with a well-defined interface, capable of being used in different applications from that for which it was originally designed. In distributed applications, a component is a basic unit of deployment and distribution.
Cortex-A: ARM processor family. Application processors with increased capabilities, typically able to run a full operating system such as Linux.
Cortex-M: ARM processor family. Smallest and lowest power processors available by ARM.
With manufacturing, cycle time can be reported for each stage of the manufacturing process or for the overall time a unit spends on the production line
DBMS: Database management system
DCM: Data collection module
DDD: Domain driven design
Descriptor: An abstract identifier used to access a file, socket, or other system resource.
DFM: Design for manufacturing
The process of optimizing a design so that it can be produced at scale without problems
Process for ensuring consistency and quality during manufacturing
DFC: Design for cost
DFU: Device Firmware Upgrade
Generally: The mode for USB products where there is no firmware or software on the device, before any install OR it thinks there is no software (erased device)
USB Specific: a vendor- and device-independent mechanism for upgrading the firmware of USB devices with improved versions provided by their manufacturers, offering (for example) a way for firmware bugfixes to be deployed.
DFV: Design for variability
DFX: Design-for-X, Design for Excellence (Microsoft)
X can be any generic trait or attribute which the team is designing for
DoDAF: Department of Defense Architecture Framework
DSM: Dependency structure matrix
DSP: Digital signal processor
dynamic shared library, dynamic library, DLL: A binary executable that is loaded dynamically into an application’s process space rather than linked statically as part of the application binary.
DIP: Dual In-line Package
DOA: Dead-on-arrival. Usually refers to new software versions not working or new boards having a flaw. This flaw is often catastrophic and renders the software/hardware unusable.
DOE: Design of experiments. Commonly used to mean "experiment"
DMM: Digital Multi-meter
DQ / DQ'd: Disqualify or disqualified
DSP: Digital signal processor
DUT: Device under test
DVT: Design validation & Test (production stage)
Used to validate that the production process can build units of sufficient quality
Units should match final design - no major design changes should be anticipated at the start of DVT.
IMU: Inertial Measurement Unit. Accelerometer, gyroscope, etc.
IO, I/O: Input/output.
IoT: Internet of things
IP: Intellectual property, Internet Protocol
IP core, IP block: A semiconductor intellectual property core. A reusable unit of logic, cell, or integrated circuit layout design that is the intellectual property of one party. Other designers will licenses these blocks for use in their own chips.
IPC: Inter-process communication
ISA: Instruction-set architecture
ISO: International Organization for Standardization
ISP: Image signal processor, in-system programming
IQ: Image quality
IQC: Incoming quality control
LOC: Lines of code
LOE: Level of effort
Looks-like Prototype: A cosmetically-focused prototype which looks like the intended product design, but does not support functional operation.
Loopers: Units that enter into the repair/return cycle repeatedly
LSB: Least significant bit
LT, L/T: Lead-time. How long it takes to get a part made/shipped.
LTV: Lifetime value of a customer. Total profit made from a customer, including hardware, software subscriptions, and other revenue sources. Also referred to as "CLV"
LUT: Look-up table
LVDS: Low-voltage differential signaling. When used in the context of hardware displays, it refers to FPD-Link, a hardware standard for communicating with displays.
MAC: Media access control. Refers to an address.
MARTE: Modeling and Analysis of Real-Time Embedded Systems. A UML profile (UML extension) focused on concepts for real-time embedded systems.
PE: Process Engineer (Mfg), Principle Engineer (Engineering)
PFOL: Product first offline. Review first production units onsite at company location.
PHY: Indicates a "physical" layer, or the actual electrical connection and encoding hardware of a communication protocol
PLL: Phase-locked loop
PLM: Project lifecycle management. The process of managing the entire lifecycle of a product from inception, through engineering design and manufacture, to service and disposal of manufactured products.
PM: Program/project manager
PMBus: Power Management Bus
PMIC: Power management IC
PMU: Power management unit
PO: Purchase order
Typically less refined than a "prototype", used for validating a problem
Often assembled with off-the-shelf parts
POSIX: Portable Operating System Interface
PN, P/N: Part number
PNP: A type of bipolar junction transistor consisting of a layer of N-doped semiconductor between two-layers of P-doped material
Post-snap: After a form factor unit has been completely closed - assembly is finished.
PRD: Product requirements document
PRQ: Post ramp qualification. A controlled production run done during MP (after ramp) to validate a change prior to converting full production to the new design. Often done to validate new part versions or alternate sources.
Scrap Rate: The percentage of units that must be thrown away due to defects. Also known as "fallout"
SDHC: SD (as in SD card) High Capacity
SDIO: Secure digital input/output. Electronics communication bus.
SDL: Specification and Description Language
SDXC: SD (as in SD Card) Extended Capability
semaphore: A protected variable that restricts access to a shared resource
Mutexes and conditions are both different types of semaphore.
SERDES: Serializer/Deserializer. A pair of functional blocks commonly used in high-speed communications to compensate for limited input/output. These blocks convert data between serial data and parallel interfaces in each direction.
SFC: Shop floor control
SFR: Special function register - provides an interface to core and peripheral hardware functionality of a microprocessor or microcontroller. They are commonly mapped into the processor’s address space, similar to RAM
SHA: Secure hash algorithms. A family of cryptographic hash functions that are commonly used in computer systems.
SHARK: Sharing and Reusing Architectural Knowledge
SIMD: Single-instruction, multiple data
SIP: System-in-a-package. A number of integrated circuits enclosed in a single module (package)
SKU: Stock Keeping Unit
Identifies unique products - each configuration (revision, color option, size option) will have a unique SKU
Internally generated part numbers used to keep track of inventory/sales.
SLA: Service-level agreement
SMA: Surface mount assembly. Refers to putting parts on a PCB. After SMA, a PCB is referred to as a PCBA.
SMT: Surface mount technology. Also refers to the SMA + board testing process as a whole.
SN, S/N: Serial Number
SOA: Service-oriented architecture
SoC: System-on-a-chip. A complex processor with peripheral devices included in a single chip package
SOF: Cameras - Start of Frame
SOM: System-on-module. A board-level circuit that integrates a system function in a single module.
SOUP: Software of Unknown Pedigree
SPE: Secure processing environment, an ARM concept
SPI: Serial peripheral interface [communication bus], Software Process Improvement
SPL: Software Product Line
SRP: Stack resource policy, a scheduler implementation
Stakeholder: Someone who has a vested interest in the topic at hand (business, architecture, design, program)
Target Hardware Bottleneck: A common experience for embedded developers, especially with regards to concurrent hardware and software development. Refers to any one of these common time-wasters:
Target hardware is not ready, delaying software testing
Target hardware is expensive, making it difficult for developers to test on the target hardware
Target hardware is scarce, making it difficult for developers to test on the target hardware
Bugs on target hardware and untested target software leading to long periods of debugging
Long build times
Long flashing/loading times
Difficulty debugging on target hardware
T/C: Thermal cycling
TDD: Test-driven development
TEE: Trusted execution environment (ARM concept)
Tier 1/2/3 CMs: A ranking of CMs by annual revenue (not quality):
Tier 1: $1B+
Tier 2: $200M - $1B
Tier 3: $10M-200M
Tier 1/2/3 Supplier : Suppliers are ranked by their hierarchy in the chain. Tier 1 suppliers provide full assemblies, and purchase sub-assemblies from Tier 2 suppliers, who purchase components and raw materials from Tier 3 suppliers.
TIL: Test issues list
Thermocouple: An electronic component used to sense temperature
Throughput Yield: the probability that any unit will make it through the entire manufacturing process without failing. Calculated by multiplying the first-pass yield of each stage
TLCD: Top-level Context Diagram
TOGAF: The Open Group Architecture Framework
Hardware: large metal molds used for mass-producing injection molded plastic or stamped metal parts
Software: programs that support development, such as debuggers, build tools, analyzers, linters
Tri-state (logic): Most modern GPIO lines are implemented as a tri-state buffer. This means that the GPIO line can effectively assume three values: logical 0 (connection to ground), logical 1 (connectin to VCC), and High-impedance (also called "floating", "Hi-Z", "tri-stated")